Computer Keyboard RoHS PCB Assembly

Negotiable 5 Pieces (MOQ)
Min. Order:
5 Pieces
Production Capacity:
25000 Square Maters Per Month
Transport Package:
Vacuum Packing, Anti-Static Package
Payment Terms:
L/C, T/T, D/P, Paypal, Money Gram, Western Union

Fulltronics Corporation Ltd.

Guangdong, China

Last Login Date:

Nov 14, 2020

Business Type:

Manufacturer/Factory

Main Products:

Flexible PCB, PCB, PCBA, PCB Assembly, Circuit Board, Printed Circuit Board, Rigid PCB, Singlesided PCB, Doublesided PCB, Multylayer PCB

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Product Description

Company Info

Basic Info.

Model NO.
fc 541
Metal Coating
Mode of Production
Base Material
Certification
RoHS, CCC, ISO
Customized
Board Thickness
1.6mm
Min Hole
0.1mm
Copper Thickness
1oz
Min. Line Width
0.1mm
Min. Line Spacing
0.1mm
Surface Finishing
Solder Mask
Green/Blue/White/Black/Red
Silk Screen
White/Blue/Yellow
Trademark
OEM
Specification
RoHS
Origin
Shenzhen, China

Product Description

OEM/ODM/EMS Services for PCBA:
PCBA, PCB Board assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha, 4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm. (18"X14")
Min Component size 0201-54 sq. Mm. (0.084 sq. Inch), long connector, CSP, BGA, QFP
Speed 0.15 sec/chip, 0.7 sec/QFP
Capability - PTH
Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3



If you need to get a formal quotation, please provide the spec as below:
1. PCB files in gerber file, . Pcb or. Pcbdoc formart
Please feel free to contact Fulltronics team. We are here ready to assist you with our professional skills and cheerful services
Stencil size/range:736x736mm
Minimum IC pitch:0.30mm
Maximum PCB size:1200x 500mm
Minimum PCB thickness:0.35mm
Minimum chip size:0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:74x74mm
BGA ball pitch:1.00mm   (minimum), 3.00mm (maximum)
BGA ball diameter:0.40mm   (minimum), 1.00mm (maximum)
QFP lead pitch:0.38mm   (minimum), 2.54mm (maximum)
Frequency of stencil cleaning:1 time/5 to 10 pieces

 
Turn Times:Quick turn are our Specialty
Volume:One piece to low valume production quantityes

Low cost first article builds

Schedule deliveries
Assembly type:Surface mount(SMT) assembly

Thru-hole

Mixed(surface mount and thu-hole) technology

Single or double sided placement

Cable assembly
Components type:Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch

 
Stencil:Laser cut stainless steel
Parts procurements:Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest
Solder type:Leaded

Lead-free/ROHS compliant
Other capabilities:Repair/rework services

Mechanical assembly

Box build/electromechanical assembly

Mould and plastic injection.

Send your message to this supplier
Mr. Daniel Wu

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